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ispLSI 2128/A
In-System Programmable High Density PLD Features
* ENHANCEMENTS -- ispLSI 2128A is Fully Form and Function Compatible to the ispLSI 2128, with Identical Timing Specifcations and Packaging -- ispLSI 2128A is Built on an Advanced 0.35 Micron E2CMOS(R) Technology * HIGH DENSITY PROGRAMMABLE LOGIC -- -- -- -- -- 6000 PLD Gates 128 I/O Pins, Eight Dedicated Inputs 128 Registers High Speed Global Interconnect Wide Input Gating for Fast Counters, State Machines, Address Decoders, etc. -- Small Logic Block Size for Random Logic * HIGH PERFORMANCE E2CMOS(R) TECHNOLOGY -- -- -- -- -- -- --
Output Routing Pool (ORP) D7 D6 D5 D4 Output Routing Pool (ORP) D3 D2 D1 D0 C7
(R)
Functional Block Diagram
Output Routing Pool (ORP)
A0
A1
C6
A2
A3
ES IG N
D Q D Q
C5
C4
Output Routing Pool (ORP)
A4
D
Q
GLB
C3
A5
C2
A6
D
D
Q
C1
A7
EW
Global Routing Pool (GRP)
B2 B3 B4 B5 B6 B7
C0
fmax = 100 MHz Maximum Operating Frequency tpd = 10 ns Propagation Delay
TTL Compatible Inputs and Outputs Electrically Erasable and Reprogrammable Non-Volatile 100% Tested at Time of Manufacture Unused Product Term Shutdown Saves Power
Output Routing Pool (ORP)
Output Routing Pool (ORP)
N
CLK 0 CLK 1 CLK 2
0139(9A)/2128
B0
B1
* IN-SYSTEM PROGRAMMABLE
U
Copyright (c) 2002 Lattice Semiconductor Corp. All brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
LATTICE SEMICONDUCTOR CORP., 5555 Northeast Moore Ct., Hillsboro, Oregon 97124, U.S.A. Tel. (503) 268-8000; 1-800-LATTICE; FAX (503) 268-8556; http://www.latticesemi.com
SE
-- Complete Programmable Device Can Combine Glue Logic and Structured Designs -- Enhanced Pin Locking Capability -- Three Dedicated Clock Input Pins -- Synchronous and Asynchronous Clocks -- Programmable Output Slew Rate Control to Minimize Switching Noise -- Flexible Pin Placement -- Optimized Global Routing Pool Provides Global Interconnectivity
LS
I2
12
* OFFERS THE EASE OF USE AND FAST SYSTEM SPEED OF PLDs WITH THE DENSITY AND FLEXIBILITY OF FIELD PROGRAMMABLE GATE ARRAYS
8E
-- In-System Programmable (ISPTM) 5V Only -- Increased Manufacturing Yields, Reduced Time-toMarket and Improved Product Quality -- Reprogram Soldered Devices for Faster Prototyping
is p
FO
R
Description
The ispLSI 2128 and 2128A are High Density Programmable Logic Devices. The devices contains128 Registers, 128 Universal I/O pins, eight Dedicated Input pins, three Dedicated Clock Input pins, two dedicated Global OE input pins and a Global Routing Pool (GRP). The GRP provides complete interconnectivity between all of these elements. The ispLSI 2128 and 2128A feature 5V insystem programmability and in-system diagnostic capabilities. The ispLSI 2128 and 2128A offer nonvolatile reprogrammability of the logic, as well as the interconnect to provide truly reconfigurable systems. The basic unit of logic on these devices is the Generic Logic Block (GLB). The GLBs are labeled A0, A1 .. D7 (Figure 1). There are a total of 32 GLBs in the ispLSI 2128 and 2128A devices. Each GLB is made up of four macrocells. Each GLB has 18 inputs, a programmable AND/OR/Exclusive OR array, and four outputs which can be configured to be either combinatorial or registered. Inputs to the GLB come from the GRP and dedicated inputs. All of the GLB outputs are brought back into the GRP so that they can be connected to the inputs of any GLB on the device.
January 2002
2128_09
1
Output Routing Pool (ORP)
Logic Array
Output Routing Pool (ORP)
S
Specifications ispLSI 2128/A
Functional Block Diagram
Figure 1. ispLSI 2128/A Functional Block Diagram
SDI/IN 7 SDO/IN 6 I/O 127 I/O 126 I/O 125 I/O 124 I/O 123 I/O 122 I/O 121 I/O 120 I/O 119 I/O 118 I/O 117 I/O 116 I/O 115 I/O 114 I/O 113 I/O 112 I/O 111 I/O 110 I/O 109 I/O 108 I/O 107 I/O 106 I/O 105 I/O 104 I/O 103 I/O 102 I/O 101 I/O 100 I/O 99 I/O 98 I/O 97 I/O 96
RESET
GOE 0 GOE 1
Input Bus
Megablock
Generic Logic Blocks (GLBs)
I/O 4 I/O 5 I/O 6 I/O 7 I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13 I/O 14 I/O 15 I/O 16 I/O 17 I/O 18 I/O 19 I/O 20 I/O 21 I/O 22 I/O 23 I/O 24 I/O 25 I/O 26 I/O 27 I/O 28 I/O 29 I/O 30 I/O 31 SCLK/IN 0 MODE/IN 1
Output Routing Pool (ORP)
I/O 0 I/O 1 I/O 2 I/O 3
A0
Output Routing Pool (ORP)
A1
A2
EW
A3
Input Bus
N
Output Routing Pool (ORP)
Global Routing Pool (GRP)
Input Bus
A4
Output Routing Pool (ORP)
R
A5
FO
A6
A7
28
E
21
B0
B1
B2
B3
B4
B5
B6
B7
CLK 0 CLK 1 CLK 2
Output Routing Pool (ORP)
Input Bus
Output Routing Pool (ORP)
ispEN
SI
I/O 32 I/O 33 I/O 34 I/O 35
I/O 36 I/O 37 I/O 38 I/O 39
I/O 40 I/O 41 I/O 42 I/O 43
I/O 44 I/O 45 I/O 46 I/O 47
I/O 48 I/O 49 I/O 50 I/O 51
I/O 52 I/O 53 I/O 54 I/O 55
I/O 56 I/O 57 I/O 58 I/O 59
pL
The device also has 128 I/O cells, each of which is directly connected to an I/O pin. Each I/O cell can be individually programmed to be a combinatorial input, output or bi-directional I/O pin with 3-state control. The signal levels are TTL compatible voltages and the output drivers can source 4 mA or sink 8 mA. Each output can be programmed independently for fast or slow output slew rate to minimize overall output switching noise.
SE
The GRP has as its inputs, the outputs from all of the GLBs and all of the inputs from the bi-directional I/O cells. All of these signals are made available to the inputs of the GLBs. Delays through the GRP have been equalized to minimize timing skew. Clocks in the ispLSI 2128 and 2128A devices are selected using the dedicated clock pins. Three dedicated clock pins (Y0, Y1, Y2) or an asynchronous clock can be selected on a GLB basis. The asynchronous or Product Term clock can be generated in any GLB for its own clock.
Eight GLBs, 32 I/O cells, two dedicated inputs and two ORPs are connected together to make a Megablock (Figure 1). The outputs of the eight GLBs are connected to a set of 32 universal I/O cells by the two ORPs. Each ispLSI 2128 and 2128A device contains four Megablocks.
U
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2
I/O 60 I/O 61 I/O 62 I/O 63
IN 2 IN 3
Y0 Y1 Y2
D ES IG N
C7 I/O 95 I/O 94 I/O 93 I/O 92 I/O 91 I/O 90 I/O 89 I/O 88 I/O 87 I/O 86 I/O 85 I/O 84 I/O 83 I/O 82 I/O 81 I/O 80 I/O 79 I/O 78 I/O 77 I/O 76 I/O 75 I/O 74 I/O 73 I/O 72 I/O 71 I/O 70 I/O 69 I/O 68 I/O 67 I/O 66 I/O 65 I/O 64 C6 C5 C4 C3 C2 C1 C0
0139(10A)/2128
D7
D6
D5
D4
D3
D2
D1
D0
IN 5 IN 4
S
Output Routing Pool (ORP)
Output Routing Pool (ORP)
Specifications ispLSI 2128/A
Absolute Maximum Ratings 1
Supply Voltage Vcc .................................. -0.5 to +7.0V Input Voltage Applied ........................ -2.5 to VCC +1.0V Off-State Output Voltage Applied ..... -2.5 to VCC +1.0V Storage Temperature ................................ -65 to 150C Case Temp. with Power Applied .............. -55 to 125C Max. Junction Temp. (TJ) with Power Applied ... 150C
1. Stresses above those listed under the "Absolute Maximum Ratings" may cause permanent damage to the device. Functional operation of the device at these or at any other conditions above those indicated in the operational sections of this specification is not implied (while programming, follow the programming specifications).
DC Recommended Operating Condition
SYMBOL PARAMETER Supply Voltage Input Low Voltage Input High Voltage Commercial Industrial
EW
D ES IG N
MIN. 4.75 4.5 0 2.0 MAX. 5.25 5.5 0.8 Vcc+1
VCC VIL VIH
TA = 0C to + 70C
N
TA = -40C to + 85C
R
Capacitance (TA=25C, f=1.0 MHz)
SYMBOL PARAMETER Clock Capacitance
E
FO
TYPICAL 8 15
UNITS pf pf
TEST CONDITIONS VCC = 5.0V, VI/O, IN = 2.0V VCC = 5.0V, VY = 2.0V
Table 2-0006/2128
Data Retention
pL
PARAMETER
SI
Data Retention Specifications
21
C1 C2
I/O and Dedicated Input Capacitance
28
MINIMUM 20 10,000
MAXIMUM - -
UNITS Years Cycles
Table 2-0008/2128
Erase/Reprogram Cycles
U
SE
is
3
S
UNITS V V V V
Table 2 - 0005/2128
Specifications ispLSI 2128/A
Switching Test Conditions
Input Pulse Levels Input Rise and Fall Time Input Timing Reference Levels Output Timing Reference Levels Output Load GND to 3.0V 3ns 10% to 90% 1.5V 1.5V See Figure 2
Figure 2. Test Load
+ 5V R1
Output Load Conditions (see Figure 2)
TEST CONDITION A B Active High Active Low Active High to Z at VOH -0.5V Active Low to Z at VOL +0.5V R1 470 470 470 R2 390 390 390 390 390 CL 35pF 35pF 35pF 5pF 5pF
*CL includes Test Fixture and Probe Capacitance.
0213A
C
Table 2 - 0004A/2000
Over Recommended Operating Conditions
FO
DC Electrical Characteristics
R
N
EW
pL
VOL VOH IIL IIH IIL-isp IIL-PU IOS1 ICC2, 4
E
SYMBOL
PARAMETER Output Low Voltage Output High Voltage
CONDITION
28
IOL= 8 mA IOH = -4 mA 3.5V VIN VCC
D ES IG N
R2 C L*
MIN. - 2.4 - - - - - - - TYP. - - - - - - - 165 165
3
3-state levels are measured 0.5V from steady-state Table 2 - 0003/2000 active level.
Device Output
MAX. UNITS 0.4 - -10 10 -150 -150 -200 325 - V V A A A A mA mA mA
Input or I/O High Leakage Current ispEN Input Low Leakage Current
21
Input or I/O Low Leakage Current
0V VIN VIL (Max.) 0V VIN VIL 0V VIN VIL VCC = 5V, VOUT = 0.5V VIL = 0.0V, VIH = 3.0V fCLOCK = 1 MHz Commercial Industrial
I/O Active Pull-Up Current
Output Short Circuit Current
Operating Power Supply Current
SI
U
1. One output at a time for a maximum duration of one second. VOUT = 0.5V was selected to avoid test problems by tester ground degradation. Characterized but not 100% tested. 2. Measured using eight 16-bit counters. 3. Typical values are at VCC = 5V and T = 25C. A 4. Maximum I CC varies widely with specific device configuration and operating frequency. Refer to the Power Consumption section of this data sheet and the Thermal Management section of the Lattice Semiconductor Data Book or CD-ROM to estimate maximum I CC .
SE
is
4
S
Test Point
Table 2-0007/2128
Specifications ispLSI 2128/A
External Timing Parameters
Over Recommended Operating Conditions
PARAMETER TEST 2 # COND. A A A - - - A - - - - A - B C B C - - 1 2 3 4 5 6 7 8 9
4
DESCRIPTION
1
-100 - -
3 1 tsu2 + tco1
-80 - - 81.0 57.0 83.0 9.0 - 0.0 - 15.0 18.5 -
MIN. MAX. MIN. MAX. 10.0 13.0 - - -
UNITS ns ns MHz MHz MHz ns ns ns ns ns ns ns ns ns ns ns ns ns ns
18 External Synchronous Clock Pulse Duration, High 19 External Synchronous Clock Pulse Duration, Low
FO
tpd1 tpd2 fmax fmax (Ext.) fmax (Tog.) tsu1 tco1 th1 tsu2 tco2 th2 tr1 trw1 tptoeen tptoedis tgoeen tgoedis twh twl
1. 2. 3. 4.
Data Propagation Delay, 4PT Bypass, ORP Bypass Data Propagation Delay Clock Frequency with Internal Feedback Clock Frequency, Max. Toggle GLB Reg. Setup Time before Clock, 4 PT Bypass GLB Reg. Clock to Output Delay, ORP Bypass GLB Reg. Hold Time after Clock, 4 PT Bypass GLB Reg. Setup Time before Clock Clock Frequency with External Feedback (
10 GLB Reg. Clock to Output Delay 11 GLB Reg. Hold Time after Clock 12 Ext. Reset Pin to Output Delay 13 Ext. Reset Pulse Duration 14 Product Term OE, Enable 15 Product Term OE, Disable 16 Global OE, Enable 17 Global OE, Disable
EW
N
R
U
SE
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pL
SI
21
28
Unless noted otherwise, all parameters use the GRP, 20 PTXOR path, ORP and Y0 clock. Refer to Timing Model in this data sheet for further details. Standard 16-bit counter using GRP feedback. Reference Switching Test Conditions section.
E
5
D ES IG N
100 6.5 - - - - 5.0 - - - - 15.0 15.0 9.0 9.0 - - 0.0 - - 8.0 11.0 0.0 - 10.0 - - - - 6.0 6.0 - 6.0 0.0 - 6.5 - - - - 5.0 5.0 - 13.5 - - -
)
77.0
Table 2-0030B/2128-100
S
- 6.5 8.0 17.0 18.0 18.0 12.0 12.0
100
Specifications ispLSI 2128/A
Internal Timing Parameters1
Over Recommended Operating Conditions
PARAMETER #2 DESCRIPTION -100 -80 UNITS
MIN. MAX. MIN. MAX. - - - 0.5 2.2 1.7 - - - 1.8 4.4
Inputs
tgrp
GLB
22 GRP Delay 23 4 Product Term Bypass Path Delay 24 4 Product Term Bypass Path Delay 25 1 Product Term/XOR Path Delay 26 20 Product Term/XOR Path Delay 27 XOR Adjacent Path Delay
3
D ES IG N
- - 5.8 5.8 6.8 7.3 8.0 0.5 - - 0.3 1.3 6.1 8.6 7.1 1.4 0.4 1.6 10.0 4.2 4.2 4.8 2.7 2.7 9.2 - - - - - -
GRP
t4ptbpc t4ptbpr t1ptxor t20ptxor txoradj tgbp tgsu tgh tgco tgro tptre tptoe tptck
ORP
28 GLB Register Bypass Delay 29 GLB Register Setup Time befor Clock 30 GLB Register Hold Time after Clock 31 GLB Register Clock to Output Delay 32 GLB Register Reset to Output Delay 33 GLB Product Term Reset to Register Delay 35 GLB Product Term Clock Delay 36 ORP Delay 37 ORP Bypass Delay 38 Output Buffer Delay
EW
- - 1.2 4.0 - - - - 4.1 - - - - - - - 2.7 2.7 -
- - 1.4 6.0 - - - - 5.6 - - - - - - - 3.6 3.6 -
N
R
FO
34 GLB Product Term Output Enable to I/O Cell Delay
10.2 2.0 0.5 2.0 10.0 4.6 4.6 7.4 3.6 3.6 11.4
torp torpbp
Outputs
28
E
41 I/O Cell OE to Output Disabled 42 Global Output Enable
pL
tob tsl toen todis tgoe
Clocks
21
40 I/O Cell OE to Output Enabled
SI
39 Output Slew Limited Delay Adder
SE
tgy0 tgy1/2 tgr
is
43 Clock Delay, Y0 to Global GLB Clock Line (Ref. clock) 44 Clock Delay, Y1 or Y2 to Global GLB Clock Line 45 Global Reset to GLB
Global Reset
U
1. Internal Timing Parameters are not tested and are for reference only. 2. Refer to Timing Model in this data sheet for further details. 3. The XOR adjacent path can only be used by hard macros.
Table 2- 0036C/2128-100
6
S
2.6 8.1 6.8 8.0 8.8 9.8 1.3 - - 0.4 1.6 8.6 9.0
tio tdin
20 Input Buffer Delay 21 Dedicated Input Delay
ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns ns
Specifications ispLSI 2128/A
ispLSI 2128/A Timing Model
I/O Cell GRP Feedback Ded. In Comb 4 PT Bypass #23 GRP #22 Reg 4 PT Bypass #24 20 PT XOR Delays #25 - 27 Reset #45 D RST #29 - 32 GLB Reg Bypass #28 GLB Reg Delay Q ORP Bypass #37 ORP Delay #36 #38, 39 I/O Pin (Output) GLB ORP I/O Cell
#21 I/O Delay #20
Control RE PTs OE #33 - 35 CK #43, 44 #42
Y0,1,2 GOE0, 1
EW
th
tco
pL
SI
= = = 12.6 ns =
Clock (max) + Reg co + Output (tio + tgrp + tptck(max)) + (tgco) + (torp + tob) (#20+ #22+ #35) + (#31) + (#36 + #38) (0.5 + 1.7 + 7.1) + (0.3) + (1.4 + 1.6)
Table 2-0042/2128
Note: Calculations are based upon timing specifications for the ispLSI 2128/A-100L.
U
SE
is
21
28
= = = 3.8 ns =
Clock (max) + Reg h - Logic (tio + tgrp + tptck(max)) + (tgh) - (tio + tgrp + t20ptxor) (#20+ #22+ #35) + (#30) - (#20+ #22+ #26) (0.5 + 1.7 + 7.1) + ( 4.0) + (0.5 + 1.7 + 7.3)
E
FO
tsu
= = = 4.4 ns =
Logic + Reg su - Clock (min) (tio + tgrp + t20ptxor) + (tgsu) - (tio + tgrp + tptck(min)) (#20+ #22+ #26) + (#29) - (#20+ #22+ #35) (0.5 + 1.7 + 7.3) + (1.2) + (0.5 + 1.7 + 4.1)
7
R
Derivations of tsu, th and tco from the Product Term Clock
N
D ES IG N
#40, 41
0491
S
I/O Pin (Input)
Specifications ispLSI 2128/A
Power Consumption
Power consumption in the ispLSI 2128 and 2128A devices depends on two primary factors: the speed at which the device is operating and the number of Product Terms used. Figure 4 shows the relationship between power and operating speed.
Figure 4. Typical Device Power Consumption vs fmax
ispLSI 2128/A
ICC (mA)
250 200 150 100 0 20 60 80 fmax (MHz) 40 100
21
The ICC estimate is based on typical conditions (VCC = 5.0V, room temperature) and an assumption of two GLB loads on average exists. These values are for estimates only. Since the value of ICC is sensitive to operating conditions and the program in the device, the actual ICC should be verified.
0127B/2128
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SE
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pL
SI
28
Where: # of PTs = Number of Product Terms used in design # of nets = Number of Signals used in device Max freq = Highest Clock Frequency to the device (in MHz)
E
FO
ICC (mA) = 20 + (# of PTs * 0.48) + (# of nets * Max freq * 0.009)
8
R
ICC can be estimated for the ispLSI 2128/A using the following equation:
N
Notes: Configuration of eight 16-bit counters Typical current at 5V, 25 C
EW
D ES IG N
300
S
Specifications ispLSI 2128/A
Pin Description
NAME
I/O 0 - I/O 4 I/O 5 - I/O 9 I/O 10 - I/O 14 I/O 15 - I/O 19 I/O 20 - I/O 24 I/O 25 - I/O 29 I/O 30 - I/O 34 I/O 35 - I/O 39 I/O 40 - I/O 44 I/O 45 - I/O 49 I/O 50 - I/O 54 I/O 55 - I/O 59 I/O 60 - I/O 64 I/O 65 - I/O 69 I/O 70 - I/O 74 I/O 75 - I/O 79 I/O 80 - I/O 84 I/O 85 - I/O 89 I/O 90 - I/O 94 I/O 95 - I/O 99 I/O 100 - I/O 104 I/O 105 - I/O 109 I/O 110 - I/O 114 I/O 115 - I/O 119 I/O 120 - I/O 124 I/O 125 - I/O 127 IN 2 - IN 5 GOE 0, GOE 1 RESET Y0, Y1, Y2 ispEN SDI/IN 72
PQFP/MQFP PIN NUMBERS
25, 32, 37, 42, 48, 54, 59, 65, 70, 76, 82, 87, 93, 106, 113, 118, 123, 129, 135, 140, 146, 152, 157, 3, 8, 15, 26, 33, 38, 43, 49, 55, 60, 66, 72, 77, 83, 88, 94, 108, 114, 119, 124, 130, 136, 141, 147, 153, 158, 4, 9, 16, 28, 34, 39, 44, 50, 56, 61, 67, 73, 78, 84, 89, 95, 109, 115, 120, 126, 132, 137, 142, 148, 154, 159, 5, 11, 17 29, 35, 40, 46, 52, 57, 62, 68, 74, 79, 85, 90, 96, 110, 116, 121, 127, 133, 138, 144, 149, 155, 160, 6, 13, 30, 36, 41, 47, 53, 58, 64, 69, 75, 80, 86, 92, 105, 112, 117, 122, 128, 134, 139, 145, 150, 156, 2, 7, 14,
TQFP PIN NUMBERS
27, 35, 41, 46, 52, 59, 65, 71, 77, 83, 90, 95, 102, 116, 124, 130, 135, 141, 148, 154, 160, 167, 173, 3, 8, 16, 28, 36, 42, 47, 53, 60, 66, 72, 79, 85, 91, 96, 103, 119, 125, 131, 136, 143, 149, 155, 161, 168, 174, 4, 9, 17, 31, 37, 43, 48, 55, 61, 67, 73, 80, 86, 92, 97, 104, 120, 126, 132, 138, 145, 150, 156, 163, 169, 175, 5, 12, 18 32, 38, 44, 50, 57, 62, 68, 75, 81, 87, 93, 99, 105, 121, 127, 133, 139, 146, 151, 158, 164, 170, 176, 6, 14,
DESCRIPTION
100, 99, 20 18, 19, 101 21
110, 109, 22
FO
19, 21, 111 23
E
22
MODE/IN 12
pL
SI
SCLK/IN 02
23
24
SDO/IN 62
is
104
SE
21
28
24
25
26
114
GND VCC NC1
U
1, 81, 12, 111,
10, 107, 31, 131,
27, 45, 63, 125, 143 51, 71, 91, 151
1, 89, 13, 122, 20, 74, 128,
11, 117, 34, 144, 30, 84, 142,
29, 137, 56, 166 40, 98, 152,
49, 69, Ground (GND) 157 78, 100, VCC (+5V) 54, 64, No Connect. 108, 118 162, 172
Table 2-0002/2128
1. NC pins are not to be connected to any active signals, VCC or GND. 2. Pins have dual function capability.
9
R
97, 98, 102, 103
106, 107, 112, 113
N
Dedicated input pins to the device. Global Output Enable input pins. Active Low (0) Reset pin which resets all of the GLB registers in the device. Dedicated Clock inputs. These clock inputs are connected to one of the clock inputs of all the GLBs on the device. Input - Dedicated in-system programming enable input pin. This pin is brought low to enable the programming mode. The MODE, SDI, SDO and SCLK options become active. Input - This pin performs two functions. When ispEN is logic low, it functions as an input pin to load programming data into the device. SDI is also used as one of the two control pins for the isp state machine. When ispEN is high, it functions as a dedicated input pin. Input - This pin performs two functions. When ispEN is logic low, it functions as a clock pin for the Serial Shift Register. When ispEN is high, it functions as a dedicated input pin. Input - This pin performs two functions. When ispEN is logic low, it functions as pin to control the operation of the isp state machine. When ispEN is high, it functions as a dedicated input pin. Output/Input - This pin performs two functions. When ispEN is logic low, it functions as the pin to read the isp data. When ispEN is high, it functions as a dedicated input pin.
EW
33, Input/Output Pins - These are the general purpose I/O pins 39, used by the logic array. 45, 51, 58, 63, 70, 76, 82, 88, 94, 101, 115, 123, 129, 134, 140, 147, 153, 159, 165, 171, 2, 7, 15,
D ES IG N
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Specifications ispLSI 2128/A
Pin Configuration
ispLSI 2128/A 160-Pin PQFP Pinout Diagram
I/O 113 I/O 112 I/O 111 I/O 110 I/O 109 I/O 108 I/O 107 I/O 106 I/O 105 VCC I/O 104 I/O 103 I/O 102 I/O 101 I/O 100 I/O 99 I/O 98 GND I/O 97 I/O 96 I/O 95 I/O 94 I/O 93 I/O 92 I/O 91 I/O 90 I/O 89 I/O 88 I/O 87 VCC I/O 86 I/O 85 I/O 84 I/O 83 I/O 82 GND I/O 81 I/O 80 I/O 79 I/O 78 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133 132 131 130 129 128 127 126 125 124 123 122 121
GND I/O 114 I/O 115 I/O 116 I/O 117 I/O 118 I/O 119 I/O 120 I/O 121 GND I/O 122 VCC I/O 123 I/O 124 I/O 125 I/O 126 I/O 127 Y0 Y1 RESET ispEN 1SDI/IN 7 1 SCLK/IN 0 1MODE/IN 1 I/O 0 I/O 1 GND I/O 2 I/O 3 I/O 4 VCC I/O 5 I/O 6 I/O 7 I/O 8 I/O 9 I/O 10 I/O 11 I/O 12 I/O 13
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40
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SE
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1. Pins have dual function capability.
160-PQFP/2128A
I/O 14 I/O 15 I/O 16 I/O 17 GND I/O 18 I/O 19 I/O 20 I/O 21 I/O 22 VCC I/O 23 I/O 24 I/O 25 I/O 26 I/O 27 I/O 28 I/O 29 I/O 30 I/O 31 I/O 32 I/O 33 GND I/O 34 I/O 35 I/O 36 I/O 37 I/O 38 I/O 39 I/O 40 VCC I/O 41 I/O 42 I/O 43 I/O 44 I/O 45 I/O 46 I/O 47 I/O 48 I/O 49
pL
41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80
SI
21
28
E
FO
10
R
Top View
N
ispLSI 2128/A
EW
D ES IG N
120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89 88 87 86 85 84 83 82 81
S
I/O 77 I/O 76 I/O 75 I/O 74 I/O 73 I/O 72 I/O 71 I/O 70 I/O 69 VCC I/O 68 I/O 67 I/O 66 GND I/O 65 I/O 64 SDO/IN 61 IN 5 IN 4 Y2 GOE 0 GOE 1 IN 3 IN 2 I/O 63 I/O 62 I/O 61 I/O 60 I/O 59 VCC I/O 58 I/O 57 I/O 56 I/O 55 I/O 54 I/O 53 I/O 52 I/O 51 I/O 50 GND
Specifications ispLSI 2128/A
Pin Configuration
ispLSI 2128/A 176-Pin TQFP Pinout Diagram
I/O 113 I/O 112 I/O 111 I/O 110 NC1 I/O 109 I/O 108 I/O 107 I/O 106 I/O 105 VCC I/O 104 I/O 103 I/O 102 NC1 I/O 101 I/O 100 I/O 99 I/O 98 GND I/O 97 I/O 96 I/O 95 I/O 94 NC1 I/O 93 I/O 92 I/O 91 I/O 90 I/O 89 I/O 88 I/O 87 VCC I/O 86 NC1 I/O 85 I/O 84 I/O 83 I/O 82 GND I/O 81 I/O 80 I/O 79 I/O 78 176 175 174 173 172 171 170 169 168 167 166 165 164 163 162 161 160 159 158 157 156 155 154 153 152 151 150 149 148 147 146 145 144 143 142 141 140 139 138 137 136 135 134 133
is
I/O 14 I/O 15 I/O 16 I/O 17 GND I/O 18 I/O 19 I/O 20 I/O 21 1 NC I/O 22 VCC I/O 23 I/O 24 I/O 25 I/O 26 I/O 27 I/O 28 I/O 29 1NC I/O 30 I/O 31 I/O 32 I/O 33 GND I/O 34 I/O 35 I/O 36 I/O 37 1NC I/O 38 I/O 39 I/O 40 VCC I/O 41 I/O 42 I/O 43 I/O 44 I/O 45 1NC I/O 46 I/O 47 I/O 48 I/O 49
pL
45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88
SI
GND I/O 114 I/O 115 I/O 116 I/O 117 I/O 118 I/O 119 I/O 120 I/O 121 1NC GND I/O 122 VCC I/O 123 I/O 124 I/O 125 I/O 126 I/O 127 Y0 1NC Y1 RESET ispEN 2SDI/IN 7 2SCLK/IN 0 2MODE/IN 1 I/O 0 I/O 1 GND 1NC I/O 2 I/O 3 I/O 4 VCC I/O 5 I/O 6 I/O 7 I/O 8 I/O 9 1NC I/O 10 I/O 11 I/O 12 I/O 13
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44
Top View
21
28
E
FO
R
N
ispLSI 2128/A
132 131 130 129 128 127 126 125 124 123 122 121 120 119 118 117 116 115 114 113 112 111 110 109 108 107 106 105 104 103 102 101 100 99 98 97 96 95 94 93 92 91 90 89
EW
U
SE
1. NC pins are not to be connected to any active signals, VCC or GND. 2. Pins have dual function capability.
11
D ES IG N
176-TQFP/2128A
S
I/O 77 I/O 76 I/O 75 I/O 74 NC1 I/O 73 I/O 72 I/O 71 I/O 70 I/O 69 VCC I/O 68 I/O 67 I/O 66 NC1 GND I/O 65 I/O 64 SDO/IN 62 IN 5 IN 4 Y2 GOE 0 GOE 1 NC1 IN 3 IN 2 I/O 63 I/O 62 I/O 61 I/O 60 I/O 59 VCC I/O 58 NC1 I/O 57 I/O 56 I/O 55 I/O 54 I/O 53 I/O 52 I/O 51 I/O 50 GND
Specifications ispLSI 2128/A
Part Number Description
ispLSI XXXXX - XXX X X
Device Family Device Number 2128 2128A Speed 100 = 100 MHz fmax 80 = 81 MHz fmax
X
Grade Blank = Commercial I = Industrial Package Q = PQFP M = MQFP T = TQFP Power L = Low
ispLSI 2128/A Ordering Information
COMMERCIAL FAMILY Fmax (MHz) 100 100 81 81 ispLSI 100 100 81 81 Tpd (ns) 10 10 15
N
EW
ORDERING NUMBER
R
ispLSI 2128A-100LQ160 ispLSI 2128A-100LT176 ispLSI 2128A-80LQ160 ispLSI 2128A-80LT176 ispLSI 2128-100LQ ispLSI 2128-100LT ispLSI 2128-80LQ ispLSI 2128-80LT
FO
15
E
10 10 15 15
28
21
SI
INDUSTRIAL Tpd (ns) 15 15 ORDERING NUMBER ispLSI 2128A-80LT176I ispLSI 2128-80LTI PACKAGE 176-Pin TQFP 176-Pin TQFP
Table 2-0041B/2128A
pL
FAMILY ispLSI
Fmax (MHz) 81 81
U
SE
is
12
D ES IG N
0212/2128A
PACKAGE 160-Pin PQFP 176-Pin TQFP 160-Pin PQFP 176-Pin TQFP 160-Pin PQFP 176-Pin TQFP 160-Pin PQFP 176-Pin TQFP
Table 2-0041A/2128A
S

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